Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...

SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...

Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...

(Nanowerk News) Imec engineers have, for the first time, demonstrated the fabrication of extremely small sealed cavities (less than one picoliter in volume), fabricated directly on 200mm silicon ...

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

India's backend semiconductor makers see temporary relief from material constraints linked to legacy packaging, as KLA opens ...

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apparently the fruity cargo cult Apple has already signed ...

Intel's recent earnings call highlighted a significant challenge affecting their production schedule: the company's wafer-level packaging capabilities are currently insufficient to meet the growing ...

DuPont Wafer Level Packaging Solutions, part of DuPont Electronic Technologies, has signed a joint-development agreement with Nippon Kayaku Co Ltd and its wholly owned subsidiary, MicroChem ...