Ultrasonic-assisted hot pressing (UAHP) has shown significant potential in enhancing both densification and mechanical ...

Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

VENTURA, Calif.--(BUSINESS WIRE)--Nexa3D, the ultrafast polymer 3D printing leader, announced today at Formnext, the immediate availability of its QLS 260 industrial laser sintering system as well as ...

Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...