SiSiC (reaction bonded silicon carbide, also known as RBSIC) grinding buckets are engineered to handle severe mechanical wear ...

The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.

In the world of electric (EV) and software-defined vehicles (SDV), a key challenge and opportunity besets original equipment manufacturers (OEM): that of effectively harnessing in-vehicle and silicon ...

Over the past decades, engineers have introduced numerous technologies that rely on light and its underlying characteristics. These include photonic and quantum systems that could advance imaging, ...

While all eyes tend to focus on the leading-edge silicon nodes, many mature nodes continue to enjoy robust manufacturing demand. Successive nodes stopped reducing die cost at around the 20nm node. “In ...

The advent of big data era raising significant challenges in information processing, especially in the aspect of capacity and power consumption. Situations become even worse when we consider the fact ...

Wolfspeed’s 300mm platform will unify high-volume silicon carbide manufacturing for power electronics with advanced ...

How a single silicon chip was designed to be microwave and optical signal-processing engine. The various roles for which this engine can be reconfigured. The performance considerations that were ...

Made of silicon, these in-sensor visual processing arrays can both capture and process visual data in the analog domain, as opposed to conventional systems that often physically separate these ...

Silicon Labs is poised to benefit as AI processing moves from data centers to embedded devices on the edge of networks.