This paper presents a novel 3-phase IGBT module called the SPM (Smart Power Module). This is a new design developed to provide a very compact, low cost, high perfor- mance and reliable motor drive ...
SINGAPORE, March 25, 2025 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company") announced the launch of Asterion-PW, extending its ...
Professor Singisetti at the University at Buffalo discusses the commercialisation path for Gallium Oxide in high-power ...
The automotive industry has experienced significant changes in recent years due to electrification and the growing demand for enhanced safety, comfort, and luxury features. In today’s high-end ...
BorgWarner to present its next-generation double-sided cooled (DSC) 800V SiC power module for high-current-density applications on May 16, 2025, at 9:00 am CET Expert-led virtual presentation about a ...
As part of the BEYOND5 project, CEA-Leti was responsible for developing a RF power module (FEM) combining three essential RF functions: a power amplifier (PA), which amplifies transmitted signals; a ...
Together Spacechips and Vicor have partnered to design the most power-dense, reliable processer board on orbit. The AI1 board ...
The MCPF1412 from Microchip Technology is a high-efficiency, fully integrated point-of-load 12-A power module integrating a 16-V V IN buck converter and support for I2C and PMBus interfaces. Its ...
This post sponsored by Texas Instruments. TI's PMP10572 reference design is a single output isolated Fly-Buck power supply for Power of Ethernet applications. The design provides 12V 1A output from ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback