Universal semi-automated platform measures diverse wafer materials and surfaces with SEMI and ASTM standard compliance.

Fracture mechanics in heterogeneous materials encompasses the study of crack initiation and propagation in systems comprising multiple constituent phases or layers with differing mechanical properties ...

Recently, a research team led by Prof. NI Yong and Prof. HE Linghui from the University of Science and Technology of China (USTC) uncovered the propagation and toughening mechanism of tortuous crack ...

The classification of heterogeneous/gradient materials and the corresponding laser powder bed fusion (LPBF) methods are introduced. According to the mode of interface composition transition (discrete ...

The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is requesting information to guide the establishment of a domestic research and development (R&D) center for ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...

In the race to extend Moore’s Law through advanced packaging, the limits of precision are no longer defined solely by lithography. Increasingly, they are dictated by the unpredictable behavior of ...

Microtransfer printing (µTP) is an advanced manufacturing technique that enables the precise transfer of micro and nanoscale materials from a donor substrate to a receiving substrate. This process ...

Nanomechanical behavior of a biomimetic nacre coating on glass observed via in situ SEM nanoindentation, demonstrating nanoscale crack deflection and strain hardening. (Image: F. de Luca) ...

As the global semiconductor industry pushes forward with advanced processes, heterogeneous integration, and cutting-edge ...