Hill Helicopters engineered composite main rotor blades using a novel single-cure manufacturing process for stiffness and ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

The project is structured around distinct work plans, developed around technical work packages specifically tailored to the strengths of each consortium member illustrating both the comprehensiveness ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...