Materials scientists at Rice University have developed a new workflow methodology for measuring microscopic defects in diamond and other advanced semiconductor materials. By making it easier to spot ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. All of this comes at a time when the ...

Researchers have created a lightweight, cable-climbing robot equipped with a computer vision system to detect surface defects on bridge stay cables. The system achieved over 92 % detection precision ...

PacifiCorp is the largest grid operator in the Western United States, serving the growing energy needs of two million customers while protecting the environment. It is a leader in providing safe, ...