MOPIC Co., Ltd., a glasses-free 3D technology company, has launched ‘HoloGlass,’ a screen protector-type 3D solution with an integrated 3D lens that transforms smartphone screens into immersive ...

April 12, 2007 Dassault Systèmes’ in conjunction with researcher Jean-Pierre Houdin, have used cutting edge 3D technology to solve a 4500 year old riddle – how the Great Pyramid of Giza was ...

Your next smartphone could have a camera that sees in three dimensions, opening up a new range of possibilities for apps ranging from fitness to photography. Researchers at Stanford University have ...

One night in 2010, Mohit Gupta decided to try something before leaving the lab. Then a Ph.D. student at Carnegie Mellon ...

Major League Baseball introduced a new feature to its app for the 2024 season, making game action more accessible to fans. Its new platform, a live, 3D gamecast, boasts the latest technology in sports ...

Kevin is a passionate news writer and journalist with years of experience covering a variety of topics ranging from pop culture to hard-hitting local news. As a film enthusiast first and foremost, ...

AMD has better detailed its next-gen 3D V-Cache stacking technology, where at the exciting but all-digital Hot Chips 33 symposium the company teased its current, and even future 3D stacking ...

Breakthroughs, discoveries, and DIY tips sent six days a week. Terms of Service and Privacy Policy. Cameron Underwood received a new face on January 6, 2018. By the ...

In the 1980s, printing first broke free from the constraints of 2D with the construction of the world’s earliest 3D printers. Enabling the creation of physical objects from digital files, 3D printing ...

oldiers at Fort Stewart are incorporating drones and 3D printing technology into their operations, moving away from traditional military tactics to enhance battlefield effectiveness and troop safety.

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...